主要成就
主要科研成果：（代表性论文、专利、著作等）
H.Y. Zhang, F.X. Che, T. Lin, W.S. Zhao, Modeling, analysis, design and tests for electronics packaging beyond Moore [M], Elsevier Publisher 2019.
Fengze Hou, Wenbo Wang, Hengyun Zhang#, et al, Experimental evaluation of a compact
